PCB Visual Inspection Checklist

Has the PCB substrate been examined for physical defects such as delamination, blistering, or warping?

Are the board edges smooth and free of burrs, nicks, or cracks resulting from the depanelization process?

Is the solder mask correctly aligned, with no visible peeling or encroachment onto necessary contact pads?

Are silkscreen markings (reference designators and polarity marks) clear, legible, and correctly positioned?

Is the surface free of contaminants such as flux residue, fingerprints, or dust that could impact long-term reliability?

Are all components present according to the Bill of Materials (BOM) and correctly oriented based on polarity markers?

Is there any evidence of component shifting or tombstoning (components standing on one end) after the reflow process?

Are Surface Mount Technology (SMT) components centered on their respective pads with no overhang exceeding allowable tolerances?

Are the Through-Hole Technology (THT) components seated flush against the board or at the specified standoff height?

Are IC pins and fine-pitch leads straight and properly seated without visible damage or deformation?

Do the solder joints exhibit a smooth, bright, and shiny finish (for leaded) or a clean, uniform satin finish (for lead-free)?

Is the solder fillet properly formed, indicating a good wetting angle between the component lead and the pad?

Are there any visible solder bridges creating unintended electrical shorts between adjacent pads or traces?

Is the assembly free of solder balls, splashes, or webbing that could dislodge and cause future shorts?

Have all joints been inspected for voids, pinholes, or cold joints which appear dull or grainy?

Are mounting holes clear of solder or obstructions and positioned according to the design specifications?

Have any jumper wires or manual modifications been performed neatly and secured according to engineering standards?

Is the board version/revision number verified against the current production documentation?